ICT creates its flexible and stretchable printed circuit boards by patterning the boards with a series of hinge-like strain relief features (SRFs). During stretching and bending of the board, the SRFs accommodate the strain, keeping the remaining substrate material strain-free. These SRFs virtually eliminate stresses in the through-hole, surface-mount or ball-grid-array components. Using this technique, ICT circuit boards have been fabricated and demonstrated to undergo high strain loading and thousands of repeated bending cycles.

ICT circuit boards are fabricated using all conventional circuit board manufacturing processes and materials, and are specially designed for each application. We will work with you to ensure your circuit board meets any design criterion, including stretchability (in one, two, or multiple directions), flexibility, and ability to conform (internally or externally) to any surface.